Full Description

1.1This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.

1.2This standard sets purity grade levels, physical attributes, analytical methods, and packaging.

1.2.1The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.

Product Details

Published: 05/01/2016 Number of Pages: 3File Size: 1 file , 66 KB