> >IEC 60068-2-69 Ed. 1.0 b:1995
Reduced price! IEC 60068-2-69 Ed. 1.0 b:1995 View larger

IEC 60068-2-69 Ed. 1.0 b:1995

M00003251

New product

IEC 60068-2-69 Ed. 1.0 b:1995 [ Withdrawn ] Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

standard by International Electrotechnical Commission, 12/08/1995

More details

In stock

$36.08

-56%

$82.00

More info

Full Description

Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.

Product Details

Edition: 1.0 Published: 12/08/1995 Number of Pages: 43 File Size: 1 file , 2 MB