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IEC 60191-4 Ed. 2.2 b:2002

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IEC 60191-4 Ed. 2.2 b:2002 [ Withdrawn ] Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION

standard by International Electrotechnical Commission, 10/22/2002

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Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages.

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Edition: 2.2 Published: 10/22/2002 Number of Pages: 43 File Size: 1 file , 610 KB